Lam Research Corporation To Acquire Bullen Ultrasonics' Silicon

Fremont, CA - Lam Research Corporation recently announced that it has signed a definitive agreement to acquire the silicon growing and fabrication assets of Bullen Ultrasonics for approximately $175M in cash. Bullen Ultrasonics, headquartered in Eaton, Ohio, is a privately held supplier of precision machined components to the semiconductor, aerospace, automotive and other industries.

According to Lam Research Corporation under the terms of the agreement, Lam will acquire all assets related to Bullen Ultrasonics' silicon growing and fabrication business utilized in supplying chamber-critical components for Lam tools as well as for other customers in the semiconductor industry. The transaction is expected to close in 30 to 45 days. Following the closing, the silicon growing and fabrication related business will become Bullen Semiconductor, a division of Lam. The remaining assets of Bullen Ultrasonics, independent of Lam, will operate as a supplier of machining and fabrication services for non-silicon hard, brittle materials to a variety of industries according to company.

SOURCE: Lam Research Corporation